Qualcomm and Amazon have announced a long-term collaboration focused on building infrastructure tailored for artificial intelligence data centres. The partnership will centre on creating bespoke silicon designed for large-scale AI operations, with particular emphasis on inference workloads.
A key component of the initiative involves developing optical connectivity systems capable of delivering throughput up to 1.6T, alongside roadmaps for successive generations of this technology. The two companies plan to leverage Qualcomm's SerDes and optical DSP capabilities to accelerate data movement within AI data centre environments.
Amazon will contribute its AWS infrastructure expertise and artificial intelligence know-how to the venture. Qualcomm brings its track record in semiconductor design, signal processing and integrated system architecture. Additionally, Qualcomm intends to expand its reliance on AWS artificial intelligence infrastructure—including Amazon Bedrock—for its own electronic design automation operations.
As AI demand accelerates, data centre infrastructure will require advances in both computing and connectivity to deliver greater performance with more efficiency. Qualcomm is pleased to work with AWS on customised silicon and connectivity solutions, bringing decades of leadership in advanced processing and power-efficient compute, to deliver breakthrough performance and enable the next generation of AI infrastructure.
Cristiano Amon, Qualcomm President and CEO
This collaboration with Qualcomm Technologies builds on a strong foundation of partnership and reflects our shared commitment to pushing the boundaries of what's possible. By working together on customised silicon and advanced connectivity, we're delivering more performant, efficient, and cost-effective infrastructure for our customers.
Prasad Kalyanaraman, AWS VP
Source: Mobile Europe
